The conference of HPBD&IS 2020 has been successfully held online!

The 2nd International Conference on High Performance Big Data and Intelligent Systems (HPBD&IS 2020) was originally planned to be held in Shenzhen, China on May 22-25, 2020. However, with due regard to the safe and healthy environment in China and the global, HPBD&IS 2020 has been successfully held online on May 23, 2020. 

The conference papers of HPBD&IS 2020 have been published by IEEE Xplore® and indexed by EI Compendex.

More than 10 papers have been published in the Special Issue of SCI indexed journal- Concurrency and Computation Practice and Experience (CCPE).

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Organizations
SPONSORS:

IEEE Computer Society

Chinese Association for Artificial Intelligence

ORGANIZERS:

Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Institute of Semiconductors, Chinese Academy of Sciences

Shenzhen Longgang District Robotics Association

Shenzhen International Robot City Industrial Park

Professional Committee on Neural Networks and Computational Intelligence

CCF Technical Committee on Blockchain

AEEEIT Committee on Blockchain


Committees
General Chair
Prof.Xian-He Sun

Illinois Institute of Technology, USA

General Chair
Prof.Geoffrey Fox

Indiana University, USA

Program Chair
Prof.Cheng-Zhong Xu

University of Macau, China

Prof.Weijun Li

Institute of Semiconductors, CAS

Shenzhen DAPU Microelectronics Co., Ltd

Publication Chair

Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

Publicity Chair

Keke Gai, Beijing Institute of Technology, China

Organizing Chairs

Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China

Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China


Financial Chair

Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China

Website Chair

Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China

Steering Committee

Haibo He, University of Rhode Island, USA

Hong Jiang, University of Texas, Arlington, USA

Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China

Ahmed Louri, George Washington University, USA

Xian-He Sun, Illinois Institute of Technology, USA

Yuan Xie, University of California, Santa Barbara, USA

Cheng-Zhong Xu, University of Macau, China

Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA

Technical Program Committee

Imane El Alaoui, University of Ibn Tofail, Morocco

Dong An, China Agricultural University, China

Ado Adamou Abba Ari, University of Versailles St Quentin En Yvelines, France

Xiao Bai, Beihang University, China

Weiqun Cao, Beijing Forestry University, China

Aniello Castiglione, University of Naples Parthenope, Italy

Kasidit Chanchio, Thammasat University, Thailand

Bhaskar Chaudhury, Dhirubhai Ambani Inst. of Information and Communication Technology, India

Jianhai  Chen, Zhejiang University, China

Quan Chen, Shanghai Jiao Tong University, China

Renhai Chen, Tianjin University, China

Xu Chen, Institute of Semiconductors, Chinese Academy of Sciences, China

Yiqiang Chen, Institute of Computing Technology, Chinese Academy of Sciences, China

Jian Cheng, Institute of Automation, Chinese Academy of Sciences, China

Xiaoxin Cui, Peking University, China

Haojiang Deng, The Institute of Acoustics of the Chinese Academy of Sciences, China

Kamil Dimililer, Near East University, Turkey.

Shifei Ding, China University of Mining and Technology, China

Xinghao Ding, Xiamen University, China

Xiaoli Dong, Institute of Semiconductors, Chinese Academy of Sciences, China

Aleksey G. Finogeev, Penza State University, Russia

Shaojing Fu, NUDT, China

Keke Gai, Beijing Institute of Technology, China

Chengxi Gao, Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences, China

Xitong Gao, Shenzhen Institutes of Advanced Technology, China

Mohammad Samadi Gharajeh,  Islamic Azad University, Iran

Zhiguo Gong, University of Macau, China

Daniel Grosu, Wayne State University, USA

Donghui Guo, Xiamen University, China

Qi Guo, ICT/CAS, China

Song Guo, The Hong Kong Polytechnic University, China

Badr Ait Hammou, Mohammed V University in Rabat, Morocco

Haibo He, University of Rhode Island, USA

Haiwu He, Shandong Computer Science Center, National Supercomputer Center in Jinan, China

Shuibing He, University of Wuhan, China

Xubin He, Temple University, USA

Dan Huang, Sun Yat-sen University, China

Hong Jiang, University of Texas, Arlington, USA

Song Jiang, University of Texas at Arlington, USA

Hamid Khayyam, Royal Melbourne Institute of Technology University, Australia

Young Choon Lee, Macquarie University, Australia

Dajiang Lei, Chongqing University of Posts and Telecommunications, China

Jingwen Leng, Shanghai Jiao Tong University, China

Chao Li, Shanghai Jiao Tong University, China

Dong Li, University of California, USA

Li Li, Shenzhen Institutes Of Advanced TechnologyChinese Academy Of Sciences, China 

Ruifan Li, Beijing University of Posts and Telecommunications, China

Sheng Li, Zhongnan University of Economics and Law, China

Weijun Li, Institute of Semiconductors, CAS, Shenzhen DAPU Microelectronics Co., Ltd., China

Xingsen Li, Guangdong University of Technology, China

Zhuo Li,  State Street Technology (Zhejiang) Ltd., China

Fang Liu, Sun Yat-sen University, China

Yan Liu, Huaqiao University, China

Yuhong Liu, Santa Clara University, USA

Ahmed Louri, George Washington University, USA

Xueqiang Lv, Beijing Information Science and Technology University, China

Tianhui Meng, SIAT/CAS, China

Wei Meng, Beijing Forestry University, China

Neha K. Nawandar, Visvesvaraya National Institute of Technology, India

Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China

Rui Oliveira, University of Minho and INESC TEC, Portugal

Shaoliang Peng, National Supercomputing Center in Changsha,China

Calton Pu, Georgia Institute of Technology, USA

Hong Qin, Institute of Semiconductors, Chinese Academy of Sciences, China

Huang Qiong, South China Agricultural University, China

Jianlong Qiu,  Linyi University, China

M. Mustafa Rafique, Rochester Institute of Technology, USA

Hari Mohan Rai, Krishna College of Engineering, India

Jose Luis Calvo Rolle, University of A Coruña, Spain

Carlos Silvestre, University of Macau, China

Manik Sharma, DAV University Jalandhar, India

Rongxuan Shen, Institute of Semiconductors, Chinese Academy of Sciences, China

Jiwu Shu, Tsinghua University, China

Xian-He Sun, Illinois Institute of Technology, USA

Bo Tang, Mississippi State University,USA

Yufei Tang, Florida Atlantic University, USA

Christos Troussas, University of West Attica, Greece

António Amaro Costa Vieira, University of Minho, Portugal

Donghui Wang, The Institute of Acoustics of the Chinese Academy of Sciences, China

Huidong Wang, Shandong University of Finance and Economics, China

Jianping Wang, City University of Hong Kong, China

Lin Wang, Xiamen University, China

Pengjun Wang, College of Electrical and Electronic Engineering, Wenzhou University, China 

Yang Wang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

Yi  Wang, Shenzhen University, China

Pulasthi S. Wickramasinghe, Indiana University, USA

Christopher Woods, University of Bristol, UK

Fei Wu, Huazhong University of Science and Technology, China

Qingyao Wu, South China University of Technology, China

Wen Xia, Harbin Institute of Technology, China

Chunhua Xiao, Chongqing University, China

Nong Xiao, NUDT, China

Wan'ang Xiao,  Institute of Semiconductors, Chinese Academy of Sciences, China

Xiaodong Xie, Huaqiao University, China

Yuan Xie, University of California, Santa Barbara, USA

Cheng-Zhong Xu, University of Macau, China

Guoyao Xu, Alibaba Group, China

Jian Xu, Institute of Semiconductors, Chinese Academy of Sciences, China

Minxian Xu, Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences, China

Zichen Xu, Nanchang University, China

Feng Yan, University of Nevada, Reno, USA

Jun Yan, Concordia University, Canada

Guowei Yang, Nanjing Audit University, Qingdao University, China

Huihua Yang, BeijingUniversity of Posts and Telecommunications, China

Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA

Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

Jun Yi,  Chongqing University of Science and Technology, China

Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China

Yunhua Yu, China University Of Petroleum, China

Jiazheng Yuan, Beijing Open University, China

Jidong Zhai, Tsinghua University, China

Fengwei Zhang, Southern University of Science and Technology, China

Jianlin Zhang, Nanchang University, China

Liping Zhang, Institute of Semiconductors, Chinese Academy of Sciences, China

Xiaorong Zhang, California State University. SF., USA

Juanjuan Zhao, Chinese Academy of Sciences, China

Wenli Zheng, Shanghai Jiao Tong University, China

Ke Zhou, Huazhong University of Science and Technology, China

Dazhou Zhu, Institute of Food and Nutrition Development, Ministry of Agriculture and Rural Affairs, China

Keynote Speech
Prof.Torsten Hoefler

ETH Zürich, Switzerland, key member of the Message Passing Interface (MPI) Forum, Chair of the "Collective Operations and Topologies" working group.

Prof. Xian-He Sun

University Distinguished Professor of Computer Science at the Department of Computer Science in the Illinois Institute of Technology (IIT), the director of the Scalable Computing Software laboratory at IIT and guest faculty in the Mathematics and Computer Science Division at the Argonne National Laboratory.